• H Y Wang

      Articles written in Bulletin of Materials Science

    • Study of electroless copper plating on ABS resin surface modified by heterocyclic organosilane self-assembled film

      H N Zhang J Wang F F Sun D Liu H Y Wang F Wang

      More Details Abstract Fulltext PDF

      6-(3-triethoxysilylpropyl)amino-1, 3, 5-triazine-2, 4-dithiol monosodium (TES) was used to fabricate self-assembled film on corona pretreated acrylonitrile–butadiene–styrene (ABS) resin surface. The self-assembled film modified ABS resin was treated by electroless copper plating. Orthogonal test was carried out to study optimal condition of the process. The surface appearance, plating rate and thickness of electroless copper films were investigated to determine the optimal time of corona-discharge, self-assembly and electroless copper plating. SEM results indicated that porous morphology appeared on ABS resin surface modified by TES self-assembled film and the surface roughness also increased. The adhesion test showed that the adhesion property between ABS resin and copper was excellent. The surface of electroless copper film had high brightness under the optimal condition of 1 min corona-discharge, 30 min self-assembly and 10 min electroless copper plating. The electroless-copper plating temperature was 55 ∼ 60°C and pH was 13 ∼ 13.5.

  • Bulletin of Materials Science | News

    • Dr Shanti Swarup Bhatnagar for Science and Technology

      Posted on October 12, 2020

      Prof. Subi Jacob George — Jawaharlal Nehru Centre for Advanced Scientific Research, Jakkur, Bengaluru
      Chemical Sciences 2020

      Prof. Surajit Dhara — School of Physics, University of Hyderabad, Hyderabad
      Physical Sciences 2020

    • Editorial Note on Continuous Article Publication

      Posted on July 25, 2019

      Click here for Editorial Note on CAP Mode

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