Articles written in Bulletin of Materials Science
Volume 34 Issue 5 August 2011 pp 1033-1037
Mn-doped CeO2 nanorods have been prepared from CeO2 particles through a facile compositehydroxide-mediated (CHM) approach. The products were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The analysis from the X-ray photoelectron spectroscopy indicates that the manganese doped in CeO2 exists as Mn4+. The responses to humidity for static and dynamic testing proved dopingMn into CeO2 can improve the humidity sensitivity. For the sample with Mn% about 1.22, the resistance changes from 375.3 to 2.7M𝛺 as the relative humidity (RH) increases from 25 to 90%, indicating promising applications of the Mn-doped CeO2 nanorods in environmental monitoring.
Volume 34 Issue 5 August 2011 pp 1083-1087
We have investigated properties of the Cu-doped ZnO crystalline film synthesized by the hydrothermal method. X-ray diffraction and X-ray photoelectron spectroscopy results provide the evidence that Cu2+ is incorporated into the ZnO lattices. Photoluminescence spectrum of the rod arrays shows that the UV emission peak shifts a little to lower energy and its intensity decreased. There are another two emission peaks centred in blue and green regions because of the incorporation of Cu2+ ions. The rod arrays have exhibited room-temperature ferromagnetic behaviour with the remanence of 0.926 × 10-3 emu/cm3. We suggest that the exchange interaction between local spin-polarized electrons (such as the electrons of Cu2+ ions) and conductive electrons is the cause of room-temperature ferromagnetism.
Volume 37 Issue 1 February 2014 pp 71-76
6-(3-triethoxysilylpropyl)amino-1, 3, 5-triazine-2, 4-dithiol monosodium (TES) was used to fabricate self-assembled film on corona pretreated acrylonitrile–butadiene–styrene (ABS) resin surface. The self-assembled film modified ABS resin was treated by electroless copper plating. Orthogonal test was carried out to study optimal condition of the process. The surface appearance, plating rate and thickness of electroless copper films were investigated to determine the optimal time of corona-discharge, self-assembly and electroless copper plating. SEM results indicated that porous morphology appeared on ABS resin surface modified by TES self-assembled film and the surface roughness also increased. The adhesion test showed that the adhesion property between ABS resin and copper was excellent. The surface of electroless copper film had high brightness under the optimal condition of 1 min corona-discharge, 30 min self-assembly and 10 min electroless copper plating. The electroless-copper plating temperature was 55 ∼ 60°C and pH was 13 ∼ 13.5.
Volume 42 | Issue 6
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