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    • Sensors and packages based on LTCC and thick-film technology for severe conditions

      C Jacq Th Maeder P Ryser

      Volume 34 Issue 4 August 2009 pp 677-687

    • Fulltext

       

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      Permanent link:
      https://www.ias.ac.in/article/fulltext/sadh/034/04/0677-0687

    • Keywords

       

      Thick-film materials; LTCC; harsh environments; sensors; packaging.

    • Abstract

       

      Reliable operation in harsh environments such as high temperatures, high pressures, aggressive media and space, poses special requirements for sensors and packages, which usually cannot be met using polymer-based technologies. Ceramic technologies, especially LTCC (Low-Temperature Cofired Ceramic), offer a reliable platform to build hermetic, highly stable and reliable sensors and packages. This is illustrated in the present work through several such devices. The examples are discussed in terms of performance, reliability, manufacturability and cost issues.

    • Author Affiliations

       

      C Jacq1 Th Maeder1 P Ryser1

      1. Laboratoire de Production Microtechnique, Ecole Polytechnique Fédérale de Lausanne, BM 3.142 – Station 17, CH-1015 Lausanne, Switzerland

    • Dates

       
      Published
      August 2009

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