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      Permanent link:
      https://www.ias.ac.in/article/fulltext/pram/069/06/1199-1206

    • Keywords

       

      New generation of silicon tracking; new sensors; large area tracking systems for international linear collider; deep sub-micron electronics.

    • Abstract

       

      The status of the R & D activity achieved so far within the SiLC (silicon tracking for the linear collider) collaboration is reported here. It includes the following items: present status of the collaboration, new developments on sensors, on mechanics (new directions for module construction, large support structure, cooling, and alignment and integration issues), new lab test bench results on electronics and sensors. The perspectives over a period of four years are presented with a detailed test beam schedule and the roadmap including the construction of new mechanical prototypes equipped with front end and readout chips in deep sub-micron CMOS technology are discussed. Combined tests with other sub-detectors are finally addressed. This test beam program is inserted in the framework of the EUDET European project.

    • Author Affiliations

       

      A Savoy-Navarro1 on behalf of the SiLC R&D Collaboration

      1. LPNHE Universités Paris 6 et 7, and CNRS-IN2P3, 4 Place Jussieu, 75252 Paris Cedex 05, France
    • Dates

       
  • Pramana – Journal of Physics | News

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