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      Permanent link:
      https://www.ias.ac.in/article/fulltext/jcsc/112/05/0543-0550

    • Keywords

       

      Alkaline copper complexes; non-cyanide plating

    • Abstract

       

      A search for non-cyanide plating baths for copper resulted in the development of alkaline copper complex baths containing trisodium citrate [TSC] and triethanolamine [TEA]. Voltammetric studies were carried out on platinum to understand the electrochemical behaviour of these complexes. In TSC solutions, the deposition of copper involves the slow formation of a monovalent species. Adsorption of this species obeys Langmuir isotherm. In TEA solutions the deposition involves the formation of monovalent ions obeying the non-activated Temkin isotherm. Conversion of divalent to monovalent copper is also slow. In TEA and TSC alkaline copper solutions, the predominant species that undergo stepwise reduction contain only TEA ligands.

    • Author Affiliations

       

      C L Aravinda1 S M Mayanna1 V S Muralidharan2

      1. Department of Chemistry, Central College, Bangalore - 560 001, India
      2. Central Electrochemical Research Institute, Karaikudi - 630 006, India

    • Dates

       
      Published
      October 2000
      Manuscript received
      27 April 2000

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