• Underpotential deposition of copper on electrochemically treated polycrystalline Au surfaces

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      Permanent link:
      https://www.ias.ac.in/article/fulltext/jcsc/103/05/0677-0683

    • Keywords

       

      Cu-UPD; faceting; Au electrodes; anion effects

    • Abstract

       

      Cyclic voltammetric responses of electrochemically treated polycrystalline gold surfaces have been examined using Cu-UPD probe reactions (UPD-underpotential deposition). The treatment procedure used appears to induce preferential crystal orientation of the Au surface with a very small roughness factor and affords a simple method to obtain well-defined surfaces for electrochemical studies.

    • Author Affiliations

       

      K L N Phani1 S Mohan1 R Venkatachalam1

      1. Central Electrochemical Research Institute, Karaikudi - 623 006, India
    • Dates

       
  • Journal of Chemical Sciences | News

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