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    • Underpotential deposition of copper on electrochemically treated polycrystalline Au surfaces

      K L N Phani S Mohan R Venkatachalam

      Physical and Theoretical Volume 103 Issue 5 October 1991 pp 677-683

    • Fulltext

       

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      Permanent link:
      https://www.ias.ac.in/article/fulltext/jcsc/103/05/0677-0683

    • Keywords

       

      Cu-UPD; faceting; Au electrodes; anion effects

    • Abstract

       

      Cyclic voltammetric responses of electrochemically treated polycrystalline gold surfaces have been examined using Cu-UPD probe reactions (UPD-underpotential deposition). The treatment procedure used appears to induce preferential crystal orientation of the Au surface with a very small roughness factor and affords a simple method to obtain well-defined surfaces for electrochemical studies.

    • Author Affiliations

       

      K L N Phani1 S Mohan1 R Venkatachalam1

      1. Central Electrochemical Research Institute, Karaikudi - 623 006, India

    • Dates

       
      Published
      October 1991
      Manuscript received
      10 September 1990
      Manuscript revised
      16 April 1991

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