Dodecyl trimethylammonium bromide (DTAB) addition to acidified copper sulphate bath changes the morphology of copper electrodeposits on the copper single crystal planes and increases the cathodic polarization in a current density range of 2–20 mA/cm2. This has been observed in the 100,110 and 111 planes where, under different concentrations and current densities, layer type deposits are transformed to pyramidal growths and finally to polycrystalline forms in the (100) plane, ridges to polycrystalline in the (110) plane, and triangular and hexagonal pyramids become twinned and transform to polycrystalline forms in the (111) plane, in the presence of DTAB.
On (100) and (110) planes the overpotentials during deposition from pure solution increase with time while on the (111) plane overpotential decreases to a steady value with time. The overpotential values are always higher in the presence of DTAB.
The observed changes in the morphology and overpotentials are attributed to the adsorption of DTAB on the copper substrate.
Volume 134, 2022
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