Kinetics of the reaction between copper and iodine (vapour) have been studied by electrical resistance measurements. A relationship between the change in electrical resistance and thickness of the product film has been formulated. From the data, which follows a parabolic law, values of the specific reaction rate constant have been calculated. The results have been compared with the earlier reported kinetic data of the reaction, measured by the gravimetric method, and are in good agreement.
Volume 134, 2022
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