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    • Keywords


      Crack pattern; desiccation; transparent electrode; spring network; simulation.

    • Abstract


      Desiccation cracks in colloids are of the order of µm width or less. Therefore, such connected crack networks in a desiccating colloidal film can provide a very fine template for the fabrication of transparent conducting surfaces by vapour deposition of a metal onto the crack network (Rao $et al$ 2014 $Adv. Mater. Interfaces$ 1 140009). The colloidal layer is removed leaving a connected metallic network invisible to the eye. So the surface becomes conducting, while retaining its transparency. The challenge lies in maximizing electrical conductivity while retaining the transparency as far as possible. An optimal combination of the system parameters, which affect the morphology of the crack network is necessary to meet this challenge. In this work, we simulate crack pattern in desiccating colloidal films in three dimensions using a spring network model. We look for the optimal combination of system parameters, such as film thickness, material stiffness and polydispersity, which can produce the best template for producing a conducting network on transparent surfaces.

    • Author Affiliations



      1. Physics Department, Jogesh Chandra Chaudhuri College, Kolkata 700 033, India
      2. Chemistry and Physics of Materials Unit, Jawaharlal Nehru Centre for Advanced Scientific Research, Bangalore 560 064, India
      3. Centre for Nano and Soft Matter Sciences, Jalahalli, Bangalore 560 013, India
      4. Condensed Matter Physics Research Centre, Physics Department, Jadavpur University, Kolkata 700 032, India
      5. Physics Department, St. Xavier’s College, Kolkata 700 016, India
    • Dates

  • Bulletin of Materials Science | News

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      Posted on July 25, 2019

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