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    • Preparation of Cu nanoparticles by a pulsed wire evaporation process for conductive ink applications

      DONG-JIN LEE FAN-LONG JIN SOO-JIN PARK

      Volume 42 Issue 2 April 2019 Article ID 0049

    • Fulltext

       

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      Permanent link:
      https://www.ias.ac.in/article/fulltext/boms/042/02/0049

    • Keywords

       

      Cu; nanoparticles; nanopowders; electrical conductivity.

    • Abstract

       

      In the present study, Cu colloidal nanoparticles and nanopowders were successfully synthesized by a pulsed wire evaporation process. Cu-based nano-inks were prepared by mixing Cu nanoparticles with acrylic resin and solvent.Cu nanoparticles with a particle size of <20 nm were uniformly dispersed in ethylene glycol. The Cu nanopowders were successfully coated with an organic solvent composed of a hydrocarbon compound. This organic coating effectively inhibited the oxidation of Cu nanopowders. In addition, the stability of dispersion of Cu nanoparticles in the inks was improved by a ball-milling process. The electrical conductivity of the prepared Cu nano-inks was 10–28 $\mu$S cm$^{−1}$ for 20–40 wt% of Cu.

    • Author Affiliations

       

      DONG-JIN LEE1 FAN-LONG JIN2 SOO-JIN PARK3

      1. Nano Technology Inc., Daedeok-Gu, Daejon 306-801, Republic of Korea
      2. Department of Polymer Materials, Jilin Institute of Chemical Technology, Jilin City 132022, People’s Republic of China
      3. Department of Chemistry, Inha University, Nam-Gu, Incheon 402-751, Republic of Korea

    • Dates

       
      Published
      15 April 2019
      Manuscript received
      31 December 2017
      Accepted
      12 October 2018

  • Bulletin of Materials Science | News

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      Prof. Subi Jacob George — Jawaharlal Nehru Centre for Advanced Scientific Research, Jakkur, Bengaluru
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      Prof. Surajit Dhara — School of Physics, University of Hyderabad, Hyderabad
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      Posted on July 25, 2019

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