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      Permanent link:
      https://www.ias.ac.in/article/fulltext/boms/025/06/0553-0556

    • Keywords

       

      Photoresists; DUV lithography; chemically amplified (CA) resist; top surface imaging.

    • Abstract

       

      Higher resolution can be achieved in lithography by decreasing the wavelength of the exposure source. However, resist material and their processing are also important when we move to a shorter wavelength lithography technology. This paper reviews the recent development and challenges of deep-UV photoresists and their processing technology.

    • Author Affiliations

       

      P B Sahoo1 R Vyas1 M Wadhwa1 S Verma1

      1. Semiconductor Complex Limited, Industrial Area Phase-8, Mohali 160 059, India
    • Dates

       
  • Bulletin of Materials Science | News

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      Posted on July 25, 2019

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