• Nucleation and growth study of copper thin films on different substrates and wetting layers by metal-organic chemical vapour deposition

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    • Keywords


      Chemical vapour deposition; copper thin film; surface morphology

    • Abstract


      Chemical vapour deposition of copper thin films on different diffusion barrier/adhesion promoter layers have been studied. Copper thin films were grown in low pressure CVD reactor, using Cu(dpm)2 as precursor and argon as carrier gas. Growth rates, film adhesion to the substrate, and surface morphology were studied in detail.

    • Author Affiliations


      A Dutta1 J Goswami1 S A Shivashankar1

      1. Materials Research Centre, Indian Institute of Science, Bangalore - 560 012, India
    • Dates

  • Bulletin of Materials Science | News

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      Posted on July 25, 2019

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