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      https://www.ias.ac.in/article/fulltext/boms/008/03/0391-0396

    • Keywords

       

      Recrystallisation; semiconductor; silicon; laser; mosfet ; silicon-gate process

    • Abstract

       

      lpcvd polycrystalline silicon films were deposited on thermally oxidized silicon as well as onlpcvd silicon nitride deposited on silicon. Acw argon ion laser was used to recrystallize the polysilicon film into large grains (grain size from 5µm to 40µm). Boron was then implanted and standard N-channel silicon gate process and N-channel metal gate process were carried out to realisemosfets on this material. Channel mobilities upto 450 cm2/V-sec for electrons have been measured. This thin filmmosfet has a four-terminal structure with a top and a bottom gate and the influence of one gate on the drain current due to the other gate has been investigated. Comparison of theIDv-VD curves of the devices with physical models was found in good agreement.

    • Author Affiliations

       

      S Chandrasekhar1 P R Apte1 S K Roy1

      1. Solid State Electronics Group, Tata Institute of Fundamental Research, Bombay - 400 005, India
    • Dates

       
  • Bulletin of Materials Science | News

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