Back Issue - Vol. 34, Part 4,
August 2009

Special Issue on Microelectromechanical
Systems (MEMS)
 
 
Topic 
Page
Author
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Foreword

529  Rudra Pratap, K N Bhat
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Structure, properties, and MEMS and microelectronic applications of vanadium oxides

531

Robert B Darling and Shiho Iwanaga

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RF sputtering: A viable tool for MEMS fabrication

543

Sudhir Chandra, Vivekanand Bhatt and Ravindra Singh

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Microstructures using RF sputtered PSG film as a sacrificial layer in surface micromachining

557 Vivekanand Bhatt, Sudhir Chandra and Chatar Singh  Click 

A new approach to integrate PLZT thin films with microcantilevers

563 Ravindra Singh, T C Goel and
Sudhir Chandra
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Biomicrofluidics: Recent trends and future challenges

573

Tamal Das and Suman Chakraborty

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Bio-functionalization of silicon nitride-based piezo-resistive microcantilevers

591

Nitin S Kale, Manoj Joshi,
P Nageswara Rao, S Mukherji and
V Ramgopal Rao

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Of light, of MEMS: Optical MEMS in telecommunications and beyond

599

F Chollet, H B Liu, M Ashraf,
B Thubthimthong, X M Zhang,
G Hegde, A Asundi, V M Murukeshan and A Q Liu

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Fabrication of polymer-based reflowed microlenses on optical fibre with control of focal length using differential coating technique

607

Mohammed Ashraf, Franck Chollet, Murukeshan Matham and Chun Yang

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A novel MOEMS pressure sensor: Modelling and experimental evaluation

615

Patricia M Nieva, Jim Kuo,
Shiuh-Huah W Chiang and
Abdullah Syed

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An X band RF MEMS switch based on silicon-on-glass architecture

625

M S Giridhar, Ashwini Jambhalikar,
J John, R Islam, C L Nagendra,
T K Alex

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Design and characterization of in-plane MEMS yaw rate sensor

633

K P Venkatesh, Nishad Patil,
Ashok Kumar Pandey and Rudra Pratap

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Composite Si/PS membrane pressure sensors with micro and macro-porous silicon

643

L Sujatha and Enakshi Bhattacharya

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Effect of metal coating and residual stress on the resonant frequency of MEMS resonators

651

Ashok Kumar Pandey, K P Venkatesh and Rudra Pratap

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System integration design in MEMS –
A case study of micromachined load cell

663

Shishir Kumar, K P Venkatesh,
S Sam Baskar and S P Madhavi 

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Sensors and packages based on LTCC and thick-film technology for severe conditions

677

C Jacq, Th Maeder and P Ryser

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