Proximity effect of electron beam lithography
on single-electron transistors
SHU-FEN HU1,*, KUO-DONG HUANG2, YUE-MIN WAN2 and
CHIN-LUNG SUNG1
1National Nano Device Laboratories, No. 26,
Industrial Park,
2Department of Electronic Engineering,
*Corresponding author. E-mail:
sfhu@mail.ndl.org.tw
Abstract. A
simple method, based on the proximity effect of
electron beam lithography,
alleviated by exposing various
shapes in the pattern of incident
electron exposures with
various intensities, was applied to
fabricate silicon
point-contact devices. The drain
current $(I_{\rm d})$ of
the device oscillates against gate
voltage. The
electrical characteristics of the
single-electron
transistor were observed to be
consistent with the
expected behavior of electron
transport through gated
quantum dots, up to 150 K. The dependence of the
electrical characteristics on the
dot size reveals that
the $I_{\rm
d}$ oscillation follows from the Coulomb
blockade by poly-Si grains in the poly-Si dot. The
method
of fabrication of this device is
completely compatible
with complementary
metal-oxide-semiconductor technology,
raising the possibility of
manufacturing large-scale
integrated nanoelectronic
systems.
Keywords. Semiconductors; transport; nanostructures.
PACS No 73.23.Hk